FO optical polishing powder for 12-inch wafer polishing
FO optical polishing powder is a high-precision composite abrasive specially optimized for ultra-fine planarization processing of 12-inch semiconductor wafers. Adopting modified alumina and zirconia composite formula, it features uniform particle distribution, moderate and stable hardness, and excellent slurry suspension, perfectly matching the strict CMP polishing requirements of large-size wafers.
This product is professionally applied to the whole-process precision polishing of 12-inch silicon wafers, gallium arsenide, indium phosphide and other compound semiconductor wafers. It effectively removes surface micro-defects, cutting traces and uneven layers without causing micro-scratches, pits or surface stress residues. It realizes ultra-smooth surface planarization and greatly improves the flatness, parallelism and overall yield of large-diameter wafers.
With stable batch consistency and controllable material removal rate, it adapts to automated mass production of 12-inch wafers. It can perfectly replace imported high-end polishing powder, supporting customized particle specifications. Ideal for semiconductor manufacturing, optoelectronic chip substrate processing and other high-precision scenarios, it is a cost-effective and reliable core polishing material for large wafer production.
Physical properties and Chemical composition %-FO optical polishing powder for 12-inch wafer polishing
| Item | Size | Specific gravityc(g/cm3) | Chemical（%） | ||||
| Al2O3 | SiO2 | Fe2O3 | TiO2 | ZrO2 | |||
| FO | #800-#1200 | ≥3.90 | ≥45.0 | ≤20.0 | ≤0.5 | ≤2.0 | ≤33.0 |
| #1500-#3000 | ≥3.90 | ≥40.5 | ≤20.0 | ≤0.7 | ≤2.0 | ≤33.0 | |
PSD(Particle Size Distribution) of FO optical polishing powder for 12-inch wafer polishing
| Size | D0 | D3 | D50 | D94 |
| #800 | ≤32.0 | ≤27.0 | 11.3±0.9 | ≥6.5 |
| #1000 | ≤27.0 | ≤23.0 | 9.4±0.8 | ≥5.0 |
| #1200 | ≤23.0 | ≤20.0 | 7.1±0.7 | ≥4.0 |
| #1500 | ≤19.0 | ≤17.0 | 5.5±0.5 | ≥3.0 |
| #2000 | ≤15.0 | ≤14.0 | 4.5±0.4 | ≥2.0 |
| #3000 | ≤12.0 | ≤11.0 | 3.6±0.4 | ≥1.5 |
FO optical micropowder Main Applications
–Grinding and polishing of semiconductor wafers
–Surface finishing of various optical glasses
–Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
–Surface finishing of piezoelectric materials
Packing of FO optical micropowder
10kgs pvc bags+pallet
